EEG-Based Brain-Computer Interfaces
High performance silicon-based GeSn p-i-n photodetectors for short-wave i...
Rectification behavior of polarization effect induced type-II n-GaN/n-typ...
Ultra-High and Fast Ultraviolet Response Photodetectors Based on Lateral ...
Bimetal Schottky Heterojunction Boosting Energy-Saving Hydrogen Productio...
An Integrated Flexible All-Nanowire Infrared Sensing System with Record P...
Photo-excited carrier relaxation dynamics in two-dimensional InSe flakes
Deterministic Magnetization Switching Using Lateral Spin-Orbit Torque
Achieving homogeneity of InGaN/GaN quantum well by well/barrier interface...
Performance deterioration of GaN-based laser diode by V-pits in the upper...

Effect of C-doped GaN film thickness on the structural and electrical properties of AlGaN/GaN-based high electron mobility transistors



Author(s): Yao, WZ (Yao, Weizhen); Wang, LS (Wang, Lianshan); Li, FZ (Li, Fangzheng); Meng, YL (Meng, Yulin); Yang, SY (Yang, Shaoyan); Wang, ZG (Wang, Zhanguo)

Source: SEMICONDUCTOR SCIENCE AND TECHNOLOGY Volume: 34 Issue: 12 Article Number: 125006 DOI: 10.1088/1361-6641/ab4b01 Published: DEC 2019

Abstract: High-resistivity carbon doped GaN (C-GaN) is highly desirable for high electron mobility transistors (HEMTs) application to reduce the leakage current at high electric fields. Herein, we investigate the structural and electrical properties of AlGaN/GaN-based HEMTs with different thicknesses of the underlying C-GaN layer. Reciprocal space mapping analysis indicates more lattice defects within GaN layer of the AlGaN/GaN heterostructure with thicker underlying C-GaN layer. Finite element method simulations reveal that the stress distribution over the AlGaN/GaN heterostructure thickness can be tuned by increasing the underlying C-GaN layer thickness from 2 to 7 mu m. Consequently, a significant decrease of two-dimensional electrons gas mobility from 1188 to 653 cm(2) V-1 s(-1) measured by Hall effect method is observed at a higher underlying C-GaN layer thickness (7 mu m). The change of electrical properties for HEMT structures with different underlying C-GaN thicknesses is not only affected by structural quality of the epilayers but also by thermal stress over HEMT structure thickness. Our results pave the avenue for improving the electrical properties of HEMT with a suitable thickness of underlying C-GaN layer.

Accession Number: WOS:000517807300002

Author Identifiers:

Author        Web of Science ResearcherID        ORCID Number

Yao, Weizhen                  0000-0001-7064-8628

ISSN: 0268-1242

eISSN: 1361-6641

Full Text: /


北京市海淀区清华东路甲35号 北京912信箱 (100083)




版权所有 ? betway必威半导体研究所

备案号:京ICP备05085259号 京公网安备110402500052 betway必威半导体所声明